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Rulon Bearings

Rogers Arlon CLTE-XT High Precision Ceramic PTFE
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes: Microwave material for improved thermal management, Excellent dimensional stability with high degree of phase stability vs. temperature.

CLTE-XT is a micro-dispersed ceramic PTFE composite utilizing a woven fiberglass reinforcement to provide the highest degree of stability, critical in multi-layer designs.

  • Ceramic/PTFE microwave composite
  • High thermal conductivity
  • Lowest Insertion Loss in class
  • Loss Tangent (0.0012)
  • Tightest Dielectric constant and Thickness tolerance
  • Electrical phase stability vs. temperature

Benefits:

  • Excellent thermal stability of Dk and Df
  • Phase stability across temperature
  • High degree of Dimensional stability required for complex, multi-layer boards
  • Excellent CTE in X, Y and Z directions

Typical Applications:

  • Defense Microwave/RF Applications
  • Radar Manifolds
  • Phase Fed Array Antennas
  • Microwave Feed Networks
  • CNI (communication, navigation and identification) Applications
  • SIGINT, Satellite and Space Electronics
  • Phase Sensitive Electronic Applications

Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesMetricEnglishComments
Density 2.02 g/cc0.0730 lb/in³ASTM D792 Method A
Water Absorption 0.020 %0.020 %IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss  0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		Water Vapor Recovered; NASA SP-R-0022A
 0.020 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.020 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		NASA SP-R-0022A
Collected Volatile Condensable Material 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.00 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		NASA SP-R-0022A
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 23.4 MPa3400 psiCross; IPC TM-650 2.4.18.3
 27.6 MPa4000 psiMachine; IPC TM-650 2.4.18.3
Modulus of Elasticity 1.79 GPa260 ksiIPC TM-650 2.4.18.3
Flexural Strength 62.1 MPa9000 psiCross; IPC TM-650 2.4.4
 65.5 MPa9500 psiMachine; IPC TM-650 2.4.4
Compressive Modulus 1.68 GPa244 ksiASTM D3410
Poissons Ratio 0.230.23ASTM D3039
Shear Modulus 0.730 GPa106 ksiCalculated
Peel Strength 1.58 kN/m9.00 pliTo Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
 1.75 kN/m10.0 pliTo Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
 1.93 kN/m11.0 pliTo Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.85e+14 ohm-cm1.85e+14 ohm-cmE24/125; IPC TM-650 2.5.17.1
 4.25e+14 ohm-cm4.25e+14 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 5.48e+13 ohm5.48e+13 ohmE24/125; IPC TM-650 2.5.17.1
 2.49e+14 ohm2.49e+14 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant  2.79 - 2.98
@Frequency 1e+10 Hz		2.79 - 2.98
@Frequency 1e+10 Hz		varies by thickness; IPC TM-650 2.5.5.5
 2.94
@Frequency 1e+6 Hz		2.94
@Frequency 1e+6 Hz		may vary by thickness; IPC TM-650 2.5.5.3
Dielectric Strength 39.4 kV/mm1000 kV/inIPC TM-650 2.5.6.2
Dielectric Breakdown 58000 V58000 VIPC TM-650 2.5.6
Dissipation Factor  0.0011
@Temperature -40.0 °C		0.0011
@Temperature -40.0 °F
 0.0013
@Temperature 140 °C		0.0013
@Temperature 284 °F
 0.0012
@Frequency 1e+6 Hz		0.0012
@Frequency 1e+6 Hz		IPC TM-650 2.5.5.3
 0.0012
@Frequency 1e+10 Hz		0.0012
@Frequency 1e+10 Hz		IPC TM-650 2.5.5.5
Arc Resistance 250 sec250 secIPC TM-650 2.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear 8.00 µm/m-°C
@Temperature 50.0 - 150 °C		4.44 µin/in-°F
@Temperature 122 - 302 °F		IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 20.0 µm/m-°C
@Temperature 50.0 - 150 °C		11.1 µin/in-°F
@Temperature 122 - 302 °F		z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.560 W/m-K3.89 BTU-in/hr-ft²-°FASTM E1461
Decomposition Temperature 501 °C934 °FInitial; IPC TM-650 2.4.24.6
 554 °C1030 °F5 percent; IPC TM-650 2.4.24.6
Flammability, UL94 V-0V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)> 60IPC TM-650 2.4.24.1
Temperature Coefficient of Dielectric (ppm/°C)-9IPC TM-650 2.5.5.5
Z-Axis Expansion (%)1.2IPC TM-650 2.4.24 (50-260°C)

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