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Metal adhesives

Aptek 2710A/B Low modulus silicone adhesive
Categories: Polymer; Adhesive; Thermoset; Silicone

Material Notes: Low modulus silicone adhesive; -110ºC to 260ºC operating range; Low outgassing/space grade; Electrostatically Discharging (ESD)
APTEK 2710-A/B is a two component, black, low modulus, thixotropic, silicone adhesive displaying very low temperature flexibility and good physical strength properties. APTEK 2710-A/B has been designed to fully cure at room temperature and can be accelerated with a brief low temperature cure. This 100% solid system has been manufactured with highly pure resins to minimize the occurrence of ionic contamination without outgassing during cure or service.

Utilizes silicone technology providing very low Tg for excellent low temperature performance; Convenient 1:1 PBW or PBV mix ration for easy handling - ideal for cartridge dispensers/repair kits; Very flexible/low modulus over wide temperature range to absorb stress build-up during thermal cycling; Very good adhesion to various substrates when used in conjunction with APTEK P-105 primer

Information provided by Aptek Laboratories, Inc.

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Physical PropertiesMetricEnglishComments
Density 1.19 g/cc0.0430 lb/in³A Component; ASTM D1475
 1.19 g/cc0.0430 lb/in³B Component; ASTM D1475
Outgassing - Total Mass Loss 0.60 %0.60 %Cured property; at 10E-6 torr; ASTM D595
Collected Volatile Condensable Material 0.060 %0.060 %Cured property; at 10E-6 torr; ASTM D595
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 3535Cured property; ASTM D1002
Adhesive Bond Strength 1.90 MPa275 psiAl-to-Al Lap Shear; Cured property; bondline thickness on primed aluminum panels; ASTM D1002
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 200000 ohm-cm200000 ohm-cmCured property; HSC 51113
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 260 °C500 °F
Minimum Service Temperature, Air -110 °C-166 °F
Glass Transition Temp, Tg -108 °C-162 °FCured property; TMA
Flash Point >= 150 °C>= 302 °FA Component; ASTM D92
 >= 150 °C>= 302 °FB Component; ASTM D92
 
Processing PropertiesMetricEnglishComments
Processing Temperature 65.0 °C149 °FCure 1 hrs
 150 °C302 °FCure 0.25 hrs

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PAPTEK15 / 24177

Metal adhesives

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