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Metal adhesives

Henkel Loctite® 5920™ RTV Silicone Sealant
Categories: Polymer; Adhesive; Thermoset; Silicone; Silicone, RTV, Adhesive/Sealant Grade

Material Notes: LOCTITE® 5920™ is a moisture-curing, non-corrosive silicone. The thixotropic nature of LOCTITE® 5920™ reduces the migration of liquid product after application to the substrate. It has been designed specially for gasketing and sealing applications where excellent temperature resistance is required. It is also used for electrical insulating applications. This product is suitable for high temperature applications.

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Physical PropertiesMetricEnglishComments
Density 1.05 g/cc0.0379 lb/in³uncured
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 23 - 3823 - 38cured 7 days, 25°C; 45-55% RH; ISO 868
Tensile Strength, Ultimate 1.41 MPa205 psicured 7 days, 25°C; 45-55% RH; ISO 37
Elongation at Break >= 350 %>= 350 %cured 7 days, 25°C; 45-55% RH; ISO 37
Adhesive Bond Strength 0.103 MPa15.0 psiBrass; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 0.103 MPa15.0 psiABS; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 0.103 MPa15.0 psiSilicone; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 0.241 MPa35.0 psiAluminum; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 0.241 MPa35.0 psiMild Steel; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 0.241 MPa35.0 psiStainless Steel; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 0.276 MPa40.0 psiCopper; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 0.379 MPa55.0 psiZinc Plated Steel; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 0.621 MPa90.0 psiAluminum (Grit Blasted); Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 0.655 MPa95.0 psiMild Steel (Grit Blasted); Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 1.00 MPa145 psiPhenolic; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 1.28 MPa185 psiSteel (e-coated); Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 5.50e+15 ohm-cm5.50e+15 ohm-cmcured 21 days, 22°C; 45-55% RH; IEC 60093
Surface Resistance 2.00e+17 ohm2.00e+17 ohmcured 21 days, 22°C; 45-55% RH; IEC 60093
 
Thermal PropertiesMetricEnglishComments
CTE, linear 340 µm/m-°C189 µin/in-°Fcured 21 days, 22°C; 45-55% RH; ISO 11359-1
Maximum Service Temperature, Air 350 °C662 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  360 min
@Thickness 2.00 mm
6.00 hour
@Thickness 0.0787 in
room temp
 4080 min
@Thickness 5.00 mm
68.0 hour
@Thickness 0.197 in
room temp
 10100 min
@Thickness 10.5 mm
168 hour
@Thickness 0.413 in
room temp
 
Descriptive Properties
ColorCopper
Extrusion Rate>275 g/minSemco Cartridge
Gap Fill0.24 in.
Tack Free Time20 - 60 min.22°C; 45-55% RH

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PLOCT141 / 51877

Metal adhesives

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