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Rulon Bearings

Rogers Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes: CuClad 217 uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offer faster signal propagation and higher signal/noise ratios.
  • Cross Plied Woven Fiberglass, alternating plies are oriented 90° to each other
  • High PTFE to Glass Ratio
  • Better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates

Benefits:

  • Electrical and Mechanical isotropy in the X-Y Plane
  • Extremely Low Loss
  • Well Suited for Er Sensitive Circuits

Typical Applications:

  • Military Electronics (Radars, ECM, ESM)
  • Microwave Components (Filters, Couplers, LNAs, etc.)

Information provided by Arlon Materials for Electronics (MED); now a part of Rogers Corporation.
Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesMetricEnglishComments
Density 2.23 g/cc0.0806 lb/in³ASTM D792 Method A
Water Absorption 0.020 %0.020 %IPC TM-650 2.6.2.2
Outgassing - Total Mass Loss  0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.00 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		Water Vapor Recovered; NASA SP-R-0022A
 0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		NASA SP-R-0022A
Collected Volatile Condensable Material 0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		NASA SP-R-0022A
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 45.5 MPa6600 psiCross; ASTM D882
 60.7 MPa8800 psiMachine; ASTM D882
Modulus of Elasticity 1.51 GPa219 ksiCross; ASTM D638
 1.90 GPa275 ksiMachine; ASTM D638
Flexural Modulus >= 2.46 GPa>= 357 ksiASTM D790
Compressive Modulus 1.63 GPa237 ksiASTM D695
Peel Strength 2.45 kN/m14.0 pliAfter Thermal Stress; IPC TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.30e+14 ohm-cm2.30e+14 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 3.40e+12 ohm3.40e+12 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant  2.17 - 2.2
@Frequency 1e+6 Hz		2.17 - 2.2
@Frequency 1e+6 Hz		C23/50; IPC TM-650 2.5.5.3
 2.17 - 2.2
@Frequency 1e+10 Hz		2.17 - 2.2
@Frequency 1e+10 Hz		C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown >= 45000 V>= 45000 VD48/50; ASTM D149
Dissipation Factor 0.00090
@Frequency 1e+10 Hz		0.00090
@Frequency 1e+10 Hz		C23/50; IPC TM-650 2.5.5.5
Arc Resistance >= 180 sec>= 180 secD48/50; ASTM D495
 
Thermal PropertiesMetricEnglishComments
CTE, linear  28.0 µm/m-°C
@Temperature 0.000 - 100 °C		15.6 µin/in-°F
@Temperature 32.0 - 212 °F		y direction; IPC TM-650 2.4.24
 29.0 µm/m-°C
@Temperature 0.000 - 100 °C		16.1 µin/in-°F
@Temperature 32.0 - 212 °F		x direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 246 µm/m-°C
@Temperature 0.000 - 100 °C		137 µin/in-°F
@Temperature 32.0 - 212 °F		z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.261 W/m-K
@Temperature 100 °C		1.81 BTU-in/hr-ft²-°F
@Temperature 212 °F		ASTM E1225
Flammability, UL94 V-0V-0Vertical Burn
 
Descriptive Properties
Temperature Coefficient of Dielectric (ppm/°C)-151IPC TM-650 2.5.5.5 (-10 - 140°C)

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