Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bonding applications. Outstanding handling characteristics. Superior elevated temperature performance at 270°F / 132°C. Excellent out-time. Exceeds requirements of BMS 5-154. Can be used for both surfacing film and lightning strike applications.Applications: - Composite Bonding
- Composite Surfacing
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