| Thermoset TC-208 is a non-reactive, non-silicone, thermally conductive grease with a soft, nonflowable consistency. It is designed for applications where a silicone-free thermal interface material is required and where the device may later need to be easily removed from the heat sink. This formulation is ideally suited for use in thin cross-sectional thicknesses down to < 1 mil. It can be used with a variety of emerging and standard devices in flip chip, PPGA, BGA, and microBGA packages. TC-208 is ideally suited for use on microprocessor, DSP, graphic accelerator and high speed memory devices. Due to its thixotropic nature, TC-208 exhibits low bleed on a wide variety of surfaces and has a successful history of use especially in flip applications.All information provided by Lord. |
