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| |
| Physical Properties | Original Value | Comments |
|---|
| Density | 1.14 g/cc |
| Melt Density | 0.980 g/cc
@Temperature 290 °C |
| Water Absorption | 8.5 %
@Thickness 2.00 mm |
| | 1.2 %
@Thickness 3.00 mm,
Time 86400 sec |
| Moisture Absorption | 2.60 %
@Thickness 2.00 mm |
| Viscosity Number | 150 cm³/g |
| Linear Mold Shrinkage, Flow | 0.013 cm/cm |
| Linear Mold Shrinkage, Transverse | 0.013 cm/cm |
| |
| Mechanical Properties | Original Value | Comments |
|---|
| Ball Indentation Hardness | 85.0 MPa |
| | 160 MPa |
| | 180 MPa |
| Tensile Strength, Yield | 55.0 MPa |
| | 85.0 MPa |
| Elongation at Break | 4.5 % |
| | 20 % |
| | >= 50 % |
| Elongation at Yield | 4.3 % |
| | 25 % |
| Tensile Modulus | 1400 MPa |
| | 3100 MPa |
| Flexural Strength | 65.0 MPa
@Strain 3.5 % |
| | 95.0 MPa
@Strain 3.5 % |
| Flexural Modulus | 1300 MPa |
| | 2800 MPa |
| Poissons Ratio | 0.37 |
| | 0.43 |
| Izod Impact, Notched (ISO) | 3.50 kJ/m²
@Temperature -40.0 °C |
| | 4.00 kJ/m²
@Temperature -40.0 °C |
| | 4.00 kJ/m²
@Temperature -30.0 °C |
| | 4.00 kJ/m²
@Temperature -30.0 °C |
| | 5.00 kJ/m²
@Temperature 23.0 °C |
| | 10.0 kJ/m²
@Temperature 23.0 °C |
| Izod Impact, Unnotched (ISO) | 300 kJ/m²
@Temperature -30.0 °C |
| | NB
@Temperature -30.0 °C |
| | NB
@Temperature 23.0 °C |
| | NB
@Temperature 23.0 °C |
| Charpy Impact Unnotched | 400 kJ/m²
@Temperature -30.0 °C |
| | NB
@Temperature -30.0 °C |
| | NB
@Temperature 23.0 °C |
| | NB
@Temperature 23.0 °C |
| Charpy Impact, Notched | 2.50 kJ/m²
@Temperature -40.0 °C |
| | 2.50 kJ/m²
@Temperature -40.0 °C |
| | 3.50 kJ/m²
@Temperature -30.0 °C |
| | 4.50 kJ/m²
@Temperature -30.0 °C |
| | 5.50 kJ/m²
@Temperature 23.0 °C |
| | 12.0 kJ/m²
@Temperature 23.0 °C |
| Tensile Creep Modulus, 1 hour | 1200 MPa |
| Tensile Creep Modulus, 1000 hours | 650 MPa |
| |
| Electrical Properties | Original Value | Comments |
|---|
| Volume Resistivity | 1.00e+13 ohm-cm |
| | 1.00e+15 ohm-cm |
| Dielectric Constant | 3.5
@Frequency 1e+6 Hz |
| | 3.8
@Frequency 100 Hz |
| | 4.0
@Frequency 1e+6 Hz |
| | 12.8
@Frequency 100 Hz |
| Dielectric Strength | 28.0 kV/mm |
| | 31.0 kV/mm |
| Dissipation Factor | 0.0075
@Frequency 100 Hz |
| | 0.0165
@Frequency 1e+6 Hz |
| | 0.070
@Frequency 1e+6 Hz |
| | 0.58
@Frequency 100 Hz |
| Comparative Tracking Index | 600 V |
| | >= 600 V
@Thickness 3.00 mm |
| |
| Thermal Properties | Original Value | Comments |
|---|
| CTE, linear, Parallel to Flow | 100 µm/m-°C |
| CTE, linear, Transverse to Flow | 110 µm/m-°C |
| Specific Heat Capacity | 2.79 J/g-°C
@Temperature 290 °C |
| Thermal Conductivity | 0.160 W/m-K
@Temperature 290 °C |
| Melting Point | 262 °C |
| Maximum Service Temperature, Air | 140 °C |
| | 155 °C |
| Deflection Temperature at 0.46 MPa (66 psi) | 200 °C |
| Deflection Temperature at 1.8 MPa (264 psi) | 70.0 °C |
| Vicat Softening Point | 240 °C |
| Glass Transition Temp, Tg | 40.0 °C |
| | 60.0 °C |
| Flammability, UL94 | V-2
@Thickness 0.710 mm |
| | V-2
@Thickness 1.50 mm |
| Oxygen Index | 28 % |
| Glow Wire Test | 700 °C
@Thickness 0.750 mm |
| | 700 °C
@Thickness 1.00 mm |
| | 700 °C
@Thickness 1.50 mm |
| | 700 °C
@Thickness 2.00 mm |
| | 700 °C
@Thickness 3.00 mm |
| Glow Wire Ignition Temperature | 725 °C
@Thickness 0.750 mm |
| | 725 °C
@Thickness 1.50 mm |
| | 725 °C
@Thickness 3.00 mm |
| |
| Processing Properties | Original Value | Comments |
|---|
| Melt Temperature | 290 °C |
| | 280 - 300 °C |
| Mold Temperature | 70.0 °C |
| | 50.0 - 90.0 °C |
| Ejection Temperature | 190 °C |
| Drying Temperature | 80.0 °C |
| Dry Time | 2.00 - 4.00 hour |
| Moisture Content | <= 0.20 % |
| Hold Pressure | 50.0 - 100 MPa |
| |
| Descriptive Properties |
|---|
| Additives | Release agent |
| Drying Recommended | yes |
| Eff. thermal diffusivity (m²/s) | 5E-08 |
| Emission of organic compounds (µgC/g) | 2.1 |
| FMVSS Class | SE |
| ISO designation | ISO 16396-PA66,,M1G1HNR,S14-030 |
| Max. screw tangential speed (m/s) | 0.4 |
| Odor Class | 2.5 |
| Part Marking Code | >PA66< |
| Polymer | PA66 |
| Processing Hold Pressure Time (s/mm) | 4 |
| Resin Identification | PA66 |
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