MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Rulon Bearings

(Viewing data as-entered. Click here to return)
Arlon Electronic Materials 84N Polyimide Laminate and Prepreg
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: 84N is a high performance ceramic-filled polyimide prepreg based on Arlon's 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formation during through-hole drilling in filled clearance areas.

  • High Tg polyimide (>250°C) with Thermal Decomposition temperature (Td) >400°C and T300>60 minutes
  • Low z-expansion of 1% between 50-250°C offers superior PTH reliability through manufacture, assembly and in service
  • Up to 50% or more reduction in cure time compared with traditional polyimide cycles
  • Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
  • Toughened, Non-MDA chemistry resists drill cracking
  • Halogen-free chemistry
  • Compatible with lead-free solder processing
  • RoHS/WEEE compliant

Typical Applications:

  • MLB's that are designed with clearance holes in metal cores or for thick metal powder and ground planes that require the thermal stability of polyimide
  • Applications requiring significant lifetimes at elevated temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive applications, industrial sensor systems and burn-in testing of IC's.

    Information provided by ARLON Electronic Materials.

  • Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

    Click here to view all available suppliers for this material.

    Please click here if you are a supplier and would like information on how to add your listing to this material.

     
    Physical PropertiesOriginal ValueComments
    Density 1.65 g/ccASTM D792 Method A
    Water Absorption 0.15 %IPC TM-650 2.6.2.1
     
    Mechanical PropertiesOriginal ValueComments
    Modulus of Elasticity 3000 ksiIPC TM-650 2.4.18.3
    Poissons Ratio 0.15ASTM D3039
    Peel Strength 7.10 pliTo Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
     7.10 pliTo Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
     7.10 pliTo Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
     
    Electrical PropertiesOriginal ValueComments
    Volume Resistivity 1.50e+14 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
     3.00e+14 ohm-cmE24/125; IPC TM-650 2.5.17.1
    Surface Resistance 1.60e+15 ohmC96/35/90; IPC TM-650 2.5.17.1
     1.60e+15 ohmE24/125; IPC TM-650 2.5.17.1
    Dielectric Constant 4.2
    @Frequency 1e+6 Hz
    may vary with resin %; IPC TM-650 2.5.5.3
    Dielectric Strength 1200 V/milIPC TM-650 2.5.6.2
    Dissipation Factor 0.010
    @Frequency 1e+6 Hz
    IPC TM-650 2.5.5.3
    Arc Resistance 140 secIPC TM-650 2.5.1
     
    Thermal PropertiesOriginal ValueComments
    CTE, linear 14.0 - 16.0 µm/m-°C
    CTE, linear, Transverse to Flow 48.0 µm/m-°Cz, below Tg; IPC TM-650 2.4.24
     150 µm/m-°Cz, above Tg; IPC TM-650 2.4.24
    Thermal Conductivity 0.250 W/m-KASTM E1461
    Glass Transition Temp, Tg 250 °CTMA; IPC TM-650 2.4.24
    Decomposition Temperature 387 °CInitial; IPC TM-650 2.3.41
     407 °C5 percent; IPC TM-650 2.3.41
    Flammability, UL94 HB
     
    Descriptive Properties
    IPC Delamination - T260 (minutes)>60IPC TM-650 2.4.24.1
    IPC Delamination - T288 (minutes)>60IPC TM-650 2.4.24.1
    IPC Delamination - T300 (minutes)>60IPC TM-650 2.4.24.1
    Z-Axis Expansion (%)1IPC TM-650 2.4.24 (50-260°C)

    Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

    Users viewing this material also viewed the following:
    Solvay AVIMID® R Polyimide Composite
    Arlon Electronic Materials 85N Polyimide Laminate and Prepreg
    Arlon Electronic Materials 85NT Polyimide Nonwoven Aramid Laminate and Prepreg
    Copper, Cu; Annealed
    Copper, Cu; Cold Drawn

    PARLM9878 / 149031

    Aluminum Castings

    Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at info@matweb.com. We appreciate your input.

    The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2025 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.