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Rulon Bearings

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Epoxy Technology EPO-TEK® H55 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.06 g/ccPart B
 1.69 g/ccPart A
Particle Size <= 10 µm
Viscosity 250000 - 400000 cP
@Temperature 23.0 °C
1 rpm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 68
Tensile Modulus 547000 psiStorage
Shear Strength 1672 psiLap
 >= 1700 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.16e+14 ohm-cm
Dielectric Constant 6.32
@Frequency 1000 Hz
Dissipation Factor 0.0080
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 22.0 µm/m-°CBelow Tg
 79.0 µm/m-°CAbove Tg
Thermal Conductivity 0.400 W/m-K
Maximum Service Temperature, Air 250 °CContinuous
 350 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 100 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 465 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 20.0 min
@Temperature 100 °C
minimum
 45.0 min
@Temperature 80.0 °C
minimum
Pot Life 180 min
Shelf Life 6.00 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorAmberPart B
 WhitePart A
ConsistencyThixotropic paste
Mix Ratio by Weight20:1
Number of ComponentsTwo
Weight Loss0.88%200°C
 1.14%250°C
 1.52%300°C

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PPOXYT061 / 141100

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