| Rubalit® A 1898 (98%) was specifically developed in response to electrical and electronic engineering needs. In conjunction with CeramTec's complementary metallization systems, a vacuum-tight bond of high strength is achieved. Rubalit® A 1898 has high dielectric strength and volume resistivity combined with good thermal conductivity. The metallization system consists of tungsten overplated with nickel for effective hard solder wetting properties. For soft soldering purposes, an additional tin layer can be applied. The use of special brazing materials (e.g., AgCu solder) assures a reliable interface during processing and handling. Brazing is performed in an inert gas atmosphere or vacuum, using temperature/time profiles specifically adapted for each product. The result is a vacuum-tight ceramic-to-metal joint with high bond strength. Glazes can be optionally applied to each product in order to prevent contamination of the ceramic surface, which helps preserve the ceramic's insulating properties under operating conditions. |
