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Rulon Bearings

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Rogers Arlon TC600 Thermally Conductive Ceramic Filled PTFE/Woven Fiberglass Laminate
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes: Microwave material for improved thermal management - for microwave printed circuit boards

  • Thermal Conductivity and Dielectric Constant Stability across Wide Temperatures
  • Very Low Loss Tangent provides higher Amplifier or Antenna Efficiency
  • Mechanically Strong; replaces brittle laminates that cannot withstand processing, impact or High G forces
  • Priced Affordably for Commercial Applications
  • High Peel Strength for Reliable Narrow Lines

Benefits:

  • Heat Dissipation and Management
  • Replace Ceramic in Some Applications
  • Improved Processing and Reliability
  • Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs

Typical Applications:

  • Power Amplifiers, Filters and Couplers
  • Microwave Combiner and Power Divider Boards in Avionics Applications
  • Small Footprint Antennas
  • Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
  • GPS & Hand-held RFID Reader Antennas

Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesOriginal ValueComments
Density 2.90 g/ccASTM D792 Method A
Water Absorption 0.020 %IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		Water Vapor Recovered; NASA SP-R-0022A
 0.020 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		NASA SP-R-0022A
Collected Volatile Condensable Material 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		NASA SP-R-0022A
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 4300 psiCross; IPC TM-650 2.4.18.3
 5000 psiMachine; IPC TM-650 2.4.18.3
Modulus of Elasticity 280 ksiIPC TM-650 2.4.18.3
Flexural Strength 9.30 ksiCross; IPC TM-650 2.4.4
 9.60 ksiMachine; IPC TM-650 2.4.4
Peel Strength 9.00 pliTo Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
 10.0 pliTo Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
 10.0 pliTo Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 2.40e+14 ohm-cmE24/125; IPC TM-650 2.5.17.1
 1.60e+15 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 9.00e+14 ohmE24/125; IPC TM-650 2.5.17.1
 3.10e+15 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 6.15
@Frequency 1e+10 Hz		may vary by thickness; IPC TM-650 2.5.5.5
 6.15
@Frequency 1.80e+6 Hz		may vary by thickness; Resonant Cavity
Dielectric Strength 850 V/milIPC TM-650 2.5.6.2
Dielectric Breakdown 62000 VIPC TM-650 2.5.6
Dissipation Factor 0.0017
@Frequency 1.80e+9 Hz		may vary by thickness; Resonant Cavity
 0.0020
@Frequency 1e+10 Hz		may vary by thickness; IPC TM-650 2.5.5.5
Arc Resistance >= 240 secIPC TM-650 2.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 9.00 µm/m-°C
@Temperature 50.0 - 150 °C		IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 35.0 µm/m-°C
@Temperature 50.0 - 150 °C		z direction; IPC TM-650 2.4.24
Thermal Conductivity 1.10 W/m-Kz-axis; ASTM E1461
 1.40 W/m-Kx, y; ASTM E1461
Decomposition Temperature 512 °CInitial; IPC TM-650 2.4.24.6
 572 °C5 percent; IPC TM-650 2.4.24.6
Flammability, UL94 V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)> 60IPC TM-650 2.4.24.1
Temperature Coefficient of Dielectric (ppm/°C)-75IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C)
Z-Axis Expansion (%)1.5IPC TM-650 2.4.24 (50-260°C)

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