Surface Mount Adhesives Loctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.Loctite® syringe dispense products provide good performance for electronics assembly: - High Speed Dispense
- Low Temperature Cure
- Products for difficult-to-bond substrates
Loctite® 3607 Pin Transfer A surface mount adhesive for pin transfer applications. Very low moisture pickup designed for use with open reservoir applications.Rounded dot profile. Process Method: Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)
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