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CRP Windform

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3D Systems DuraForm® PA Nylon for SLS® Systems
Categories: Polymer; 3D Printing/Additive Manufacturing Polymer; Thermoplastic; Nylon (Polyamide PA)
Material Notes: For use with all selective laser sintering (SLS®) systems.

    Applications
  • Complex, thin-wall ductwork
    • Motorsports
    • Aerospace
  • Housings and enclosures
  • Impellers and connectors
  • Consumer sporting goods
  • Vehicle dashboards and grilles
  • Snap-fit designs
  • Functional prototypes that approach end-use performance properties
  • Appropriate for low- to mid-volume rapid manufacturing
  • Medical applications requiring USP Class VI compliance, or biocompatibility
  • Parts requiring machining or joining with adhesives
  • Complex production and prototype plastic parts
  • Form, fit, or functional prototypes

All information provided by 3D Systems.
Vendors:
Proto3000 provides design tools, 3D printers, additive manufacturing processes, metrology technologies, high-performance materials, and part-finishing automation. Our ISO 9001:2015 additive manufacturing production facility offers 3D printing services, rapid prototyping services, and end-part production with HP MultiJet Fusion (MJF), FDM, SLA, SLS, Polyjet, DLP, metal binder jetting, BMD, and DMLS.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.00 g/ccASTM D792
Water Absorption 0.070 %
@Time 86400 sec		ASTM D570
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 73ASTM D2240
Tensile Strength, Ultimate 43.0 MPaASTM D638
Elongation at Break 14 %ASTM D638
Tensile Modulus 1586 MPaASTM D638
Flexural Strength 48.0 MPaUltimate; ASTM D790
Flexural Modulus 1387 MPaASTM D790
Izod Impact, Notched 32.0 J/m
@Temperature 23.0 °C		ASTM D256
Izod Impact, Unnotched 3.36 J/cm
@Temperature 23.0 °C		ASTM D256
Gardner Impact 2.70 JASTM D5420
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 5.90e+13 ohm-cmASTM D257
Surface Resistance 7.00e+13 ohmASTM D257
Dielectric Constant 2.73
@Frequency 1000 Hz		ASTM D150
Dielectric Strength 17.3 kV/mmASTM D149
Dissipation Factor 0.044
@Frequency 1000 Hz		ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 82.6 µm/m-°C
@Temperature 0.000 - 50.0 °C		ASTM E831
 179.2 µm/m-°C
@Temperature 85.0 - 145 °C		ASTM E831
Specific Heat Capacity 1.64 J/g-°CASTM E1269
Thermal Conductivity 0.700 W/m-KASTM E1225
Deflection Temperature at 0.46 MPa (66 psi) 180 °CASTM D648
Deflection Temperature at 1.8 MPa (264 psi) 95.0 °CASTM D648
Flammability, UL94 HB
 
Compliance PropertiesOriginal ValueComments
USP Class VI Yes

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PAPPR117 / 83496

USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.




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