| Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method. Advantages & Application Notes: - Stencil printing of small dots or ?bumps? the size of 4 mil diameter with 8 mil pitch can be achieved
- Product may be applied at the wafer level or single-chip bumping of prototypes.
- Final system packaging can be hermetic micro-electronic cases or open-faced circuits using potting resin or housing.
- Low temperature cure capable between 70°C – 100°C allows for lower cost plastic substrates / housings to be used.
- Suggested for flip chip packaging applications found in memory devices (SRAM, DRAM), watch modules, RFID tags, smart-cards, military, and medical devices.
- Passes NASA low outgassing standard ASTM E595 with proper cure
- Compatible with Au, Cu, Ag, Ag-Pd component or substrate metallization.
- Recommended to be used with chips or wafers which have UBM layer already deposited.
- Compatible with automated dispensing equipment.
Information Provided by Epoxy Technology |
