| Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications. Advantages & Application Notes: - Rheology provides a smooth paste with excellent handling characteristics and a reasonable pot life. It can be machine-dispensed, screen printed, stamped, or applied by hand using spatula, toothpick, or many other applicators.
- Suggested for the following:
- Semiconductor applications such as Au-plated chips, Si, GaAs, Cu or Ag based lead-frames and die-paddles, JEDEC plastic IC packaging using transfer molded encapsulation processes.
- Hybrid micro-electronics; active and passive SMDs on ceramic substrates, Au and Ag-Pd contact pads, chip caps and resistors, inductors, quartz crystals, oscillators, making or repairing conductive traces on the PCB, EMI/RF shielding of the package, near-hermetic sealing, component or package grounding. Packages like DIP, or TO-can format.
- PCB level; COB die attach, substrates can be rigid like FR4 and BT, or flex like Kapton.
- Passes NASA low outgassing standard ASTM E595 with proper cure
- Designed to withstand TC wire bonding temperatures, or hybrid lid-seal processes exceeding 300°C.
Information Provided by Epoxy Technology
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