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Rulon Bearings

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Rogers Arlon CLTE Microwave Printed Circuit Board Substrate
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)

Material Notes: CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.

  • Ceramic/PTFE composite
  • Low water absorption
  • High thermal conductivity
  • Low loss
  • Tight Dk and Thickness tolerance

Benefits:

  • Thermally stable Dk and Df
  • Dimensional stability

Typical Applications:

  • Radar Manifolds
  • Phased Array Antennas
  • Microwave Feed Networks
  • Phase Sensitive Electric Structures
  • PAs, LNAs, LNBs
  • Satellite & Space Electronics

Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.

Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesOriginal ValueComments
Density 2.38 g/ccASTM D792 Method A
Water Absorption 0.040 %IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
Water Vapor Recovered; NASA SP-R-0022A
 0.020 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
NASA SP-R-0022A
Collected Volatile Condensable Material 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
NASA SP-R-0022A
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 7000 psiCross; IPC TM-650 2.4.18.3
 8200 psiMachine; IPC TM-650 2.4.18.3
Modulus of Elasticity 1050 ksiIPC TM-650 2.4.18.3
Flexural Strength 17.4 ksiCross; IPC TM-650 2.4.4
 19.1 ksiMachine; IPC TM-650 2.4.4
Compressive Modulus 225 ksiASTM D3410
Poissons Ratio 0.13ASTM D3039
Peel Strength 7.00 pliTo Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
 7.00 pliTo Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
 7.40 pliTo Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 2.25e+14 ohm-cmE24/125; IPC TM-650 2.5.17.1
 1.40e+15 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 1.30e+11 ohmC96/35/90; IPC TM-650 2.5.17.1
 7.52e+14 ohmE24/125; IPC TM-650 2.5.17.1
Dielectric Constant 2.75 - 2.98varies by thickness
 2.98
@Frequency 1e+6 Hz
may vary by thickness; IPC TM-650 2.5.5.3
 2.98
@Frequency 1e+10 Hz
may vary by thickness; IPC TM-650 2.5.5.5
Dielectric Strength 1100 V/milIPC TM-650 2.5.6.2
Dielectric Breakdown 64000 VIPC TM-650 2.5.6
Dissipation Factor 0.00225
@Temperature 0.000 °C
 0.0025
@Temperature 100 °C
 0.0015
@Frequency 1e+6 Hz
IPC TM-650 2.5.5.3
 0.0023
@Frequency 1e+10 Hz
IPC TM-650 2.5.5.5
Arc Resistance 245 secIPC TM-650 2.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 10.0 µm/m-°C
@Temperature 50.0 - 150 °C
x direction; IPC TM-650 2.4.41
 12.0 µm/m-°C
@Temperature 50.0 - 150 °C
y direction; IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 34.0 µm/m-°C
@Temperature 50.0 - 150 °C
z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.500 W/m-KASTM E1461
Decomposition Temperature 493 °COnset; IPC TM-650 2.4.24.6
 525 °C5 percent; IPC TM-650 2.4.24.6
Flammability, UL94 V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)> 60IPC TM-650 2.4.24.1
Temperature Coefficient of Dielectric (ppm/°C)-9IPC TM-650 2.5.5.5
Z-Axis Expansion (%)1.5IPC TM-650 2.4.24 (50-260°C)

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