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Chemically Resistant adhesives

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Plenco 5488 Phenolic, Granular, Injection Molded
Categories: Polymer; Thermoset; Filled/Reinforced Thermoset; Phenolic

Material Notes: PLENCO 05488 is a woodflour and graphite filled phenolic molding compound offering improved abrasion resistance. UL recognized under component file E40654. 05488 is available in brown. 05488 is not recommended for electrical insulating applications.

Information supplied by Plenco.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Bulk Density 0.650 g/ccASTM D1895
Density 1.45 g/ccASTM D792
Water Absorption 0.267 %ASTM D570
Linear Mold Shrinkage 0.0083 cm/cmASTM D955
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell E 82ASTM D785
Tensile Strength, Ultimate 61.0 MPaASTM D638
Elongation at Break 0.91 %ASTM D638
Tensile Modulus 8.50 GPaASTM D638
Flexural Strength 93.0 MPaASTM D790
Flexural Modulus 7.60 GPaASTM D790
Compressive Strength 189 MPaASTM D695
Poissons Ratio 0.35ASTM D638
Shear Modulus 3.15 GPaCalculated
Izod Impact, Notched 16.6 J/mASTM D256
Charpy Impact, Notched 0.178 J/cm²ASTM D256
Impact 100J/m Drop Ball Impact; PLENCO
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 8.00e+10 ohm-cmASTM D247
Dielectric Constant 10.2ASTM D150
Dissipation Factor 0.061ASTM D150
Arc Resistance 137 secASTM D495
Comparative Tracking Index 175 VASTM D3638
 
Thermal PropertiesOriginal ValueComments
CTE, linear 46.0 µm/m-°C
@Temperature 40.0 - 130 °C
TMA; ASTM E831
Thermal Conductivity 0.510 W/m-K
@Temperature 100 °C
ASTM E1461
Maximum Service Temperature, Air 201 °CHeat Resistance; ASTM D570D
Deflection Temperature at 1.8 MPa (264 psi) 155 °CASTM D648
Flammability, UL94 V-0
@Thickness 3.00 mm
Oxygen Index 27.5 %ASTM D2863
Shrinkage 0.269 %72 hr, 120ºC; ASTM D1299

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PLEM05 / 50681

Chemically Resistant adhesives

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