Henkel Loctite® ECCOBOND E 1172 A Epoxy

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Henkel Loctite® ECCOBOND E 1172 A Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Tan Cure: Heat Cure Product Benefits: One component Fast cure at low temperatures Low cure temperature Void-free underfill Low CTE Non-anhydride curing chemistry Long pot life Application: Underfill Typical Package Application: Flip chip devices LOCTITE ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25 micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects. Information provided by Loctite®
Vendors:

Available Properties

Density
Filler Content
Moisture Absorption, Cured, 24-hr boil
Particle Size
Brookfield Viscosity, Uncured, Spindle 3, speed 5 rpm
Hardness, Shore D, Cured
Volume Resistivity
Dielectric Constant
Dissipation Factor
CTE, linear, Cured
Glass Transition Temp, Tg, Cured
Shrinkage, on Cure
Cure Time, Fast Cure
Cure Time, Standard Cure
Cure Time, plus 5 minutes @ 135 °C, Low Stress Cure
Pot Life

Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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