Henkel Loctite® ECCOBOND FP4460 Epoxy

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Henkel Loctite® ECCOBOND FP4460 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Cure: Heat Cure Product Benefits: High purity Low stress Improved work life High temperature performance Excellent chemical resistance Excellent moisture resistance High flow Application: Encapsulant - glob top Filler Type: Silica Typical Package Application: Automotive applications, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules, BGA and Pin grid arrays LOCTITE ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. Information provided by Loctite®
Vendors:

Available Properties
Specific Gravity Filler Content Brookfield Viscosity, Spindle 7, speed 10 rpm Brookfield Viscosity, Spindle 7, speed 4 rpm CTE, linear, Cured, Below Tg Maximum Service Temperature, Air Minimum Service Temperature, Air Glass Transition Temp, Tg, Cured, by TMA Shrinkage, Cured Cure Time Pot Life, time to double viscosity Gel Time Shelf Life, from date of manufacture

Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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