Appearance: blue Cure: Heat Cure Product Benefits: - Low viscosity
- Fast flow
- Excellent wettability
- Excellent adhesion
- Ideal for high reliability applications
- Hi-Pb and Pb-free applications
Application: Underfill Substrates Ceramic, Organic, Solder mask and Polyimide Typical Package Application: Ceramic packages and FC on flex LOCTITE ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications. Information provided by Loctite® |