Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy

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Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes:	Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and diodes which may be found in opto-electronics packaging or hybrid micro-electronics. Advantages & Application Notes: Rheology provides a soft, smooth, thixotropic paste. The epoxy can be screen printed or applied by hand or spatula. Ideal for screen printing applications. Designed for use in machine dispensing where dot sizes as small as 8 mils can be readily deposited. Available in lower viscosity versions. Thermal resistance is nearly equivalent to solder die-attach. Suitable for laser diode attach, TE Coolers, and heatsinking in general. Reliability report summarized in Technical Paper #2 from Epoxy Technology Information Provided by Epoxy Technology
Vendors:

Available Properties

Specific Gravity
Particle Size
Viscosity, 5 rpm
Ionic Impurities - Na (Sodium)
Ionic Impurities - K (Potassium)
Ionic Impurities - Cl (Chloride)
Hardness, Shore D
Tensile Modulus, Storage
Shear Strength, Lap
Shear Strength, Die
Volume Resistivity
CTE, linear, Below Tg
CTE, linear, Above Tg
Thermal Conductivity
Maximum Service Temperature, Air, Continuous
Maximum Service Temperature, Air, Intermittent
Minimum Service Temperature, Air, Continuous
Minimum Service Temperature, Air, Intermittent
Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min
Decomposition Temperature, Degradation Temperature
Cure Time, Minimum Bond Line
Pot Life
Shelf Life

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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