| Appearance: Silver film Cure: Heat cure Product Benefits: - Low warpage
- Thermally conductive
- Electrically conductive
- High MSL reliability
- Controlled fillet size
- No resin bleed-out
- Consistent bondline control with minimal die tilt
- Pre-cut wafer lamination equipment compatible
- Recommended for thin wafer handling applications
- Good wetting and low warpage for large die
Application: Die attach Typical Package Application: PBGA, FBGA, CSP LOCTITE ABLESTIK CDF 600 silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates. Information provided by Loctite® |
