COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.
Loctite® 3564 Fast flow epoxy, moderate CTE and Tg Fast Flow Underfill
An extremely fast flowing, rapid cure underfill for industrial and consumer flip chip applications. Withstands operating temperatures up to 125°C. |
