Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® Hardener A filled, high performance flexible epoxy casting system. Little change in hardness after aging at 155°C. Recommended for potting and encapsulating transformers, coils and similar electrical devices.
- Mix Ratio, Resin/Hardener (by weight): 100/25
Cure Type: Elevated Temperature Information provided by Cytec, subsequently acquired by Elantas. |