TRA-DUCT 2705 is an electrically conductive nickel filled epoxy adhesive recommended for electronic bonding, sealing, and EMI-RFI shielding applications. This two-part smooth paste formulation is free of solvents, silver, copper or carbon additives, and is a low-cost replacement for many gold or silver based products. TRA-DUCT 2705 cures at room temperature and can be used as a "cold solder" for bonding and shielding heat sensitive components. TRA-DUCT 2705 is recommended for use where exposure to salt water causes silver based systems to corrode. It develops strong, durable bonds to substrates such as metal ceramic glass and plastic laminates. Information provided by Tra-Con Inc. |