| Product Description: EPO-TEK® H70E-4 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD / PCB level. Advantages & Application Notes: - Thixotropic epoxy which is paste-like and non-flowing. It has adhesive strength before cure.
- Paste-like rheology allows it to be applied by automated dispensing or screen printing techniques. Other methods, including by tooth-pick, are acceptable.
- Suggested Applications:
- PCB:
- Bonding heat sinks; Adhesion to Al, Cu, most metals and plastics
- Bonding SMDs to PCB; Adhesion to FR4, flex PCB, active and passive SMT packages; staking SMDs to PCB for double sided circuits
- Bonding ferrites and magnets for electronic sub-assemblies
- Semiconductor: die attach onto substrates; COB and direct-chip attach
- Hybrid: bonding heat sinks and substrate attach to metal case
- Opto-electronic: active alignment of optics and fiber optic components
- User friendly 1:1 mix ratio allows for static mixing, or specialty packaging, with lengthy pot-life available.
Information Provided by Epoxy Technology |
