| Product Description: EPO-TEK® H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications. Advantages & Application Notes: - It is a thixotropic paste and a non-sagging adhesive. It is also useful for deposition methods like dispensing, printing, or hand held processes.
- Suggested Applications:
- Hybrid:
- Staking SMDs onto the PCB for extra mechanical support; insulation layer between 2 contact pads of caps and resistors.
- Heat sinking devices on ceramic PCB and PCB to external case; adhesion to Si, Au, kovar, Al-N, BT.
- Reinforcing and extra mechanical support for wire bond integrity.
- Electronics:
- Bonding passive devices such as inductor coils, ferrites, motors, connectors, and various SMDs.
- Adhesion to FR4 and common PCB substrates and housings.
- Available in various viscosity alternatives and black color
Information Provided by Epoxy Technology |
