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Chemically Resistant adhesives

Epoxy Technology EPO-TEK® H70E-TI Thermally Conductive, Electrically Insulating Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes: Material Description: A two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronic applications.

Information Provided by Epoxy Technology
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.33 g/cc1.33 g/ccPart A
 2.07 g/cc2.07 g/ccPart B
Particle Size <= 20 µm<= 20 µm
Viscosity 2100 - 3000 cP
@Temperature 23.0 °C		2100 - 3000 cP
@Temperature 73.4 °F		100 rpm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7575
Tensile Modulus 3.78 GPa548 ksiStorage
Shear Strength 9.72 MPa1410 psiLap
 >= 11.7 MPa>= 1700 psiDie
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 5.00e+13 ohm-cm>= 5.00e+13 ohm-cm
Dielectric Constant 4.23
@Frequency 1000 Hz		4.23
@Frequency 1000 Hz
Dissipation Factor 0.0040
@Frequency 1000 Hz		0.0040
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 46.0 µm/m-°C25.6 µin/in-°FBelow Tg
 191 µm/m-°C106 µin/in-°FAbove Tg
Thermal Conductivity 0.600 W/m-K4.16 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C392 °FContinuous
 300 °C572 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 65.0 °C>= 149 °FDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 410 °C770 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time 60.0 min
@Temperature 150 °C		1.00 hour
@Temperature 302 °F		Minimum
Pot Life <= 2880 min<= 2880 min
Shelf Life 12.0 Month
@Temperature 25.0 °C		12.0 Month
@Temperature 77.0 °F
 
Descriptive Properties
ColorCreamPart A
 CreamPart B
ConsistencyPourable paste
Mix Ratio by Weight1:1
Number of ComponentsTwo
Thixotropic Index1.8
Weight Loss0.17%200°C
 0.9%250°C
 2.3%300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT077 / 141116

Chemically Resistant adhesives




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