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Chemically Resistant adhesives

Epoxy Technology EPO-TEK® H61ND Thermally Conductive, Electrically Insulating Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Material Description: A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.

Information Provided by Epoxy Technology

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Physical PropertiesMetricEnglishComments
Specific Gravity 2.27 g/cc2.27 g/cc
Particle Size <= 50 µm<= 50 µm
Viscosity 30000 - 50000 cP
@Temperature 23.0 °C
30000 - 50000 cP
@Temperature 73.4 °F
5 rpm
 
Chemical PropertiesMetricEnglishComments
Ionic Impurities - Na (Sodium) 142 ppm142 ppm
Ionic Impurities - K (Potassium) 17 ppm17 ppm
Ionic Impurities - Cl (Chloride) 90 ppm90 ppm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8383
Tensile Modulus 6.15 GPa893 ksiStorage
Shear Strength 3.49 MPa506 psiLap
 >= 46.9 MPa>= 6800 psiDie
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 3.00e+13 ohm-cm>= 3.00e+13 ohm-cm
Dielectric Constant 4.23
@Frequency 1000 Hz
4.23
@Frequency 1000 Hz
Dissipation Factor 0.0030
@Frequency 1000 Hz
0.0030
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 22.0 µm/m-°C12.2 µin/in-°FBelow Tg
 86.0 µm/m-°C47.8 µin/in-°FAbove Tg
Thermal Conductivity 0.800 W/m-K5.55 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C392 °FContinuous
 300 °C572 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 100 °C>= 212 °FDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 468 °C874 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time  30.0 min
@Temperature 150 °C
0.500 hour
@Temperature 302 °F
minimum
 60.0 min
@Temperature 120 °C
1.00 hour
@Temperature 248 °F
minimum
Pot Life 28800 min28800 min
Shelf Life 6.00 Month6.00 Monthrefrigerated
 
Descriptive Properties
ColorLight gray
ConsistencySmooth paste
Ionic Impurities NH4392 ppm
Number of ComponentsSingle
Thixotropic Index1.3
Weight Loss0.08%200°C
 0.14%250°C
 0.24%300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT064 / 141103

Chemically Resistant adhesives

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