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Epoxy Technology EPO-TEK® H61ND Thermally Conductive, Electrically Insulating Epoxy
Categories:
Polymer
;
Thermoset
;
Epoxy
;
Epoxy, Thermally Conductive
Material Notes:
Material Description: A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.
Information Provided by Epoxy Technology
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Physical Properties
Metric
English
Comments
Specific Gravity
2.27
g/cc
2.27
g/cc
Particle Size
<=
50
µm
<=
50
µm
Viscosity
30000
-
50000
cP
@Temperature 23.0 °C
30000
-
50000
cP
@Temperature 73.4 °F
5 rpm
Chemical Properties
Metric
English
Comments
Ionic Impurities - Na (Sodium)
142
ppm
142
ppm
Ionic Impurities - K (Potassium)
17
ppm
17
ppm
Ionic Impurities - Cl (Chloride)
90
ppm
90
ppm
Mechanical Properties
Metric
English
Comments
Hardness, Shore D
83
83
Tensile Modulus
6.15
GPa
893
ksi
Storage
Shear Strength
3.49
MPa
506
psi
Lap
>=
46.9
MPa
>=
6800
psi
Die
Electrical Properties
Metric
English
Comments
Volume Resistivity
>=
3.00e+13
ohm-cm
>=
3.00e+13
ohm-cm
Dielectric Constant
4.23
@Frequency 1000 Hz
4.23
@Frequency 1000 Hz
Dissipation Factor
0.0030
@Frequency 1000 Hz
0.0030
@Frequency 1000 Hz
Thermal Properties
Metric
English
Comments
CTE, linear
22.0
µm/m-°C
12.2
µin/in-°F
Below Tg
86.0
µm/m-°C
47.8
µin/in-°F
Above Tg
Thermal Conductivity
0.800
W/m-K
5.55
BTU-in/hr-ft²-°F
Maximum Service Temperature, Air
200
°C
392
°F
Continuous
300
°C
572
°F
Intermittent
Minimum Service Temperature, Air
-55.0
°C
-67.0
°F
Continuous
-55.0
°C
-67.0
°F
Intermittent
Glass Transition Temp, Tg
>=
100
°C
>=
212
°F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature
468
°C
874
°F
Degradation Temperature
Processing Properties
Metric
English
Comments
Cure Time
30.0
min
@Temperature 150 °C
0.500
hour
@Temperature 302 °F
minimum
60.0
min
@Temperature 120 °C
1.00
hour
@Temperature 248 °F
minimum
Pot Life
28800
min
28800
min
Shelf Life
6.00
Month
6.00
Month
refrigerated
Descriptive Properties
Color
Light gray
Consistency
Smooth paste
Ionic Impurities NH
4
392 ppm
Number of Components
Single
Thixotropic Index
1.3
Weight Loss
0.08%
200°C
0.14%
250°C
0.24%
300°C
Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's
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Click here
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