Epoxy Technology EPO-TEK® B9021-13 Thermally Conductive, Electrically Insulating Epoxy

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Epoxy Technology EPO-TEK® B9021-13 Thermally Conductive, Electrically Insulating Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Material Description: A single component, thermally conductive, electrically insulating, B-stageable epoxy paste. It was designed for heat sinking applications found at the semiconductor and PCB level electronics packaging. It may also be used for Bstage assembly of 1) window-sealing optical devices and sensors; 2) substrate attach and 3) lid-sealing hybrids Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	1.31 g/cc	1.31 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	15000 - 25000 cP @Temperature 23.0 °C	15000 - 25000 cP @Temperature 73.4 °F	10 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80
Tensile Modulus	2.57 GPa	372 ksi	Storage
Shear Strength	5.34 MPa	774 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	40.0 µm/m-°C	22.2 µin/in-°F	Below Tg
	143 µm/m-°C	79.4 µin/in-°F	Above Tg
Thermal Conductivity	0.960 W/m-K	6.66 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	175 °C	347 °F	Continuous
	275 °C	527 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 70.0 °C	>= 158 °F
Decomposition Temperature	345 °C	653 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 80.0 °C	0.500 hour @Temperature 176 °F	minimum, b-stage cure
	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F	minimum
Pot Life	1440 min	1440 min
Shelf Life	12.0 Month	12.0 Month	refrigerated

Descriptive Properties
Color	White
Consistency	Smooth paste
Number of Components	Single
Thixotropic Index	3.44
Weight Loss	2.48%		200°C
	4.01%		250°C
	6.8%		300°C

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PPOXYT060 / 141099

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