| PTM1300-SP is a highly compressible thermal interface material developed for applications in the memory and mobile electronics markets. It provides stable performance in low pressure environments, allowing manufacturers a wider process window in thermal module assembly. PTM1300-SP offers the same quality and reliability as Honeywell’s other industry-leading phase change materials. PTM1300-SP has an optimized filler size distribution to achieve maximum packing density compared to conventional phase change materials. PTM1300-SP changes phase at 45°C to ensure maximum surface conformance, and may be applied to a component, heat sink or thermal spreader. Features & benefits: - Wider process window in module assembly
- Stable thermal performance, even after thermal cycling and HAST
- Provides excellent compliance and rapid thermal response
- Simple to apply
- Superior handling and reworkability
Information provided by Honeywell |
