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Chemically Resistant adhesives

Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes: Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.

Advantages & Application Notes:

  • Low density silver-filled epoxy is ideal for ultrasound and acoustical applications of electronics.
  • Extended pot-life allows for mass production and low waste.
  • Suggested Applications:
    • Hybrid Micro-electronics: SMD and die attach on Au pads and ceramic substrates. Single step curing method of die and SMDs.
    • Electronics: compatible with piezo technologies for ultrasound circuits found in medical, industrial, and petrochemical industries.
    • Scientific / Life Sciences: geo-thermal, geo-seismic, infra-sound, as well as acoustical-optical circuits for interferometers and lasers.
    • Optical: bright and shiny silver flake is advantageous for LED die-attach.
  • A smooth and creamy paste allows for automated or hand dispensing, pin transfer, or screen printing application methods of manufacture.

Information Provided by Epoxy Technology
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.05 g/cc1.05 g/ccPart B
 2.10 g/cc2.10 g/ccPart A
Particle Size <= 45 µm<= 45 µm
Viscosity 15000 - 23000 cP
@Temperature 23.0 °C		15000 - 23000 cP
@Temperature 73.4 °F		10 rpm
 
Chemical PropertiesMetricEnglishComments
Ionic Impurities - Na (Sodium) 88 ppm88 ppm
Ionic Impurities - K (Potassium) 8.0 ppm8.0 ppm
Ionic Impurities - Cl (Chloride) 60 ppm60 ppm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7676
Tensile Modulus 3.34 GPa485 ksiStorage
Shear Strength >= 11.7 MPa>= 1700 psiDie
 >= 13.8 MPa>= 2000 psiLap
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.020 ohm-cm<= 0.020 ohm-cm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 28.0 µm/m-°C15.6 µin/in-°FBelow Tg
 104 µm/m-°C57.8 µin/in-°FAbove Tg
Thermal Conductivity 0.670 W/m-K4.65 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 250 °C482 °FContinuous
 350 °C662 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 100 °C>= 212 °FDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 470 °C878 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time  5.00 min
@Temperature 150 °C		0.0833 hour
@Temperature 302 °F		Minimum Bond Line
 10.0 min
@Temperature 120 °C		0.167 hour
@Temperature 248 °F		Minimum Bond Line
 20.0 min
@Temperature 100 °C		0.333 hour
@Temperature 212 °F		Minimum Bond Line
 45.0 min
@Temperature 80.0 °C		0.750 hour
@Temperature 176 °F		Minimum Bond Line
Pot Life 1080 min1080 min
Shelf Life 6.00 Month
@Temperature 25.0 °C		6.00 Month
@Temperature 77.0 °F
 
Descriptive Properties
ColorAmberPart B
 SilverPart A
ConsistencySmooth paste
Ionic Impurities NH421 ppm
Mix Ratio by Weight100:5
Number of ComponentsTwo
Thixotropic Index1.86
Weight Loss0.04%200°C
 0.04%250°C
 0.1%300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT039 / 141078

Chemically Resistant adhesives




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