85NT is a pure polyimide laminate and prepreg system (Tg = 250°C), reinforced with a non-woven aramid substrate. This system combines the high-reliability features of polyimide (improved PTH reliability and temperature stability) with the low in-plane () expansion and outstanding dimensional stability of a non-woven aramid reinforcement.- Low in-plane expansion of 6-9 ppm/°C allows attachment of SMT devices with minimal risk of solder failure joint failure due to CTE mismatch
- Nonwoven aramid reinforcement provides outstanding dimensional stability and enhanced registration for improved multilayer yields
- High Decomposition temperature offering outstanding high-temperature lifetime performance
- Polymeric reinforcement results in PCBs typically 25% lighter in weight than conventional glass-reinforced laminates
- Laser and plasma ablatable for high speed formations of microvias and other features as small as 25 microns
- Electrical and mechanical properties meeting the requirements of IPC-4101/53
- Compatible with lead-free soldering
- RoHS/WEEE compliant
Typical Applications: Military and commercial avionics, missiles and missile defense, satellites, and other high-reliability SMT applications requiring both low in-plane () CTE valuesPCBs that are subjected to high temperatures during processing, such as lead-free solderingApplications with significant lifetimes at elevated temperatures, such as aircraft engine instrumentations, on-engine applications, or industrial sensorsInformation provided by ARLON Electronic Materials. |
