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Metal adhesives

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Master Bond EP30AN-1 Low Viscosity, NASA Low Outgassing Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • Thermally conductive
  • Electrically insulative
  • Low thermal expansion coefficient
  • NASA approved for low outgassing applications
  • Low viscosity with excellent flowability
  • Superior dimensional stability
Master Bond EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low outgassing approval. It will cure at room temperature or more rapidly at elevated temperatures. Other attractive properties include superb dimensional stability and superior physical strength properties. Its low viscosity and excellent flow characteristics make it an ideal thermally conductive potting epoxy. EP30AN-1 is also an excellent adhesive/ sealant forming durable, rigid bonds that resist to thermal cycling and chemicals including water, oils, etc. over the wide temperature range of -60°F to +250°F. The coefficient of thermal expansion is desirably low. The color of Part A is gray and Part B is clear. Master Bond EP30AN-1 is widely used in applications where thermal conductivity, electrical isolation and low outgassing properties are required. It is particularly well suited to high vacuum environments.

Product Advantages:

  • Easy application: adhesive spreads or pours evenly and smoothly.
  • Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required.
  • High bond strength to a wide variety of substrates; excellent adhesive properties.
  • Exceptionally high thermal conductivity with excellent electrical insulation properties.
  • Good physical strength characteristics; especially high compressive strength.
  • Meets NASA low outgassing specifications

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Viscosity 300 - 400 cPPart B
 10000 - 18000 cPPart A
Outgassing - Total Mass Loss 0.82 %TML
Collected Volatile Condensable Material 0.020 %
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 85 - 90
Tensile Strength 5000 - 6000 psi
Compressive Strength 24000 - 26000 psi
Adhesive Bond Strength 700 - 900 psiTensile lap, Aluminum to Aluminum
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 4.80e+14 ohm-cm
Dielectric Constant 4.7
@Frequency 60 Hz
Dielectric Strength >= 400 V/mil
@Thickness 3.17 mm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 20.0 - 22.0 µm/m-°C
Thermal Conductivity 3.31 - 3.6057 W/m-K
Maximum Service Temperature, Air 250 °F
Minimum Service Temperature, Air -60.0 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 93.3 °C
 48.0 - 72.0 hour
@Temperature 23.9 °C
Working Life 30.0 - 45.0 minAfter mixing, 100 g batch
Shelf Life 6.00 Month
@Temperature <=23.9 °C
in original, unopened containers
 
Descriptive Properties
Mixing Ratio10:1 by weightParts A to B

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PMASTM855 / 185448

Metal adhesives

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