| Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications Advantages & Application Notes: - EPO TEK® 353ND-BLACK has been color-coded black for optical applications requiring opacity against light in IR and VIS region.
- Reasonable pot-life that allows for low temperature curing to be realized.
- Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
- Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high temperature packaging.
- Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:
- Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range
- Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
- Down-Hole petrochemical fiber optic sensors, resisting >200 C field conditions
- Medical suggested applications:
- Potting Fiber Optic bundles into SST ferrules for light guides and endoscopes, resisting sterilization cycles of autoclave, ETO, gamma, H202 plasma
- Electronics Assembly suggested applications:
- Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices
- Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets
- Structural grade epoxy found in hard-disk drive devices; bonding of SST metals, kapton, and magnets
Information Provided by Epoxy Technology |
