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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

Master Bond EP21AOLV-2MED Two Component Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • Excellent thermal conductivity
  • Room temperature curing
  • Convenient one to one mix ratio
  • Superior electrical insulation
  • Meets USP Class VI requirements
  • Passes ISO 10993-5 tests for cytotoxicity
Product Description: Master Bond EP21AOLV 2Med is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, coating and encapsulant. It has a convenient, one to one mix ratio by weight, a smooth consistency and good flow properties. EP21AOLV-2Med cures readily at room temperature and can be accelerated by heat. The optimum cure schedule is overnight at room temperature followed by 2-4 hours at 150-200°F. Most importantly, it has been rigorously tested for biocompatibility and passes USP Class VI testing as well as ISO 10993-5 for cytotoxicity. Its viscosity and flow properties enable it to be used for bonding as well as potting. It bonds well to a wide variety of substrates including metals, composites, glass, ceramics, plastics and many rubbers. This system resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold sterilants. EP21AOLV-2Med has a wide array of desirable physical strength properties including superb dimensional stability, a high modulus, exceptional compressive strength and very low shrinkage upon curing. It should be emphasized that this system is a fine thermal conductor while retaining impressive electrical insulation properties. Its service temperature range is -60°F to +250°F. The color of Part A is gray; the color of Part B is off-white. It’s widely used in the medical device industry and other applications where biocompatibility, thermal conductivity and electrical insulation are essential requirements.

Product Advantages:

  • Convenient handling, easy to use, one to one mix ratio by weight
  • Smooth, flowable consistency. Ideal for bonding and potting
  • Adheres well to many different substrates
  • Desirable physical strength properties, low coefficient of thermal expansion
  • Combines outstanding thermal conductivity and laudable electrical insulation properties
  • Stellar resistance to chemical sterilants, radiation and EtO
  • Passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesMetricEnglishComments
Viscosity 1500 - 3000 cP1500 - 3000 cPPart A
 50000 - 150000 cP50000 - 150000 cPPart B, thixotropic
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D >= 80>= 80
Tensile Strength 34.5 - 41.4 MPa5000 - 6000 psi
Tensile Modulus 3.45 - 3.79 GPa500 - 550 ksi
Compressive Strength 152 - 172 MPa22000 - 25000 psi
Adhesive Bond Strength 11.0 - 12.4 MPa1600 - 1800 psiTensile lap, Aluminum to Aluminum
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+14 ohm-cm>= 1.00e+14 ohm-cm
Dielectric Constant 4.7
@Frequency 60 Hz
4.7
@Frequency 60 Hz
Dielectric Strength >= 15.7 kV/mm
@Thickness 3.17 mm
>= 400 kV/in
@Thickness 0.125 in
 
Thermal PropertiesMetricEnglishComments
CTE, linear 22.0 - 25.0 µm/m-°C12.2 - 13.9 µin/in-°F
Thermal Conductivity 1.2981 - 1.4423 W/m-K9.0088 - 10.010 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 121 °C250 °F
Minimum Service Temperature, Air -51.1 °C-60.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  120 - 180 min
@Temperature 93.3 °C
2.00 - 3.00 hour
@Temperature 200 °F
 4320 - 5760 min
@Temperature 23.9 °C
72.0 - 96.0 hour
@Temperature 75.0 °F
Working Life 240 - 360 min240 - 360 minAfter mixing, 100 g batch
Shelf Life 6.00 Month
@Temperature <=23.9 °C
6.00 Month
@Temperature <=75.0 °F
in original, unopened containers
 
Compliance PropertiesMetricEnglishComments
USP Class VI YesYes
 
Descriptive Properties
Cure ScheduleOvernight at 75°Ffollowed by 3-4 hours at 150-200°F, Optimum cure
Mixing Ratio1:1 by weightParts A to B

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PMASTM818 / 185411

USP Class VI adhesives

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