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Chemically Resistant adhesives

Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.

Advantages & Application Notes:

  • Ease of use: smooth flowing paste allows for automated dispensing, stamping, brushing, or hand applications.
  • Suggested applications include: EMI and Rf shielding; ITO interconnects in LCDs; low temperature cryogenic cooling.
  • Exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.
  • Hybrid/micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.
  • Provides a metallic-like layer after cure.

Information Provided by Epoxy Technology

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 0.940 g/cc0.940 g/ccPart B
 3.43 g/cc3.43 g/ccPart A
Particle Size <= 45 µm<= 45 µm
Viscosity 55000 - 90000 cP
@Temperature 23.0 °C
55000 - 90000 cP
@Temperature 73.4 °F
1 rpm
 
Chemical PropertiesMetricEnglishComments
Ionic Impurities - Na (Sodium) 15 ppm15 ppm
Ionic Impurities - K (Potassium) 1.0 ppm1.0 ppm
Ionic Impurities - Cl (Chloride) 169 ppm169 ppm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 6060
Tensile Modulus 1.90 GPa276 ksiStorage
Shear Strength 10.2 MPa1480 psiLap
 >= 21.1 MPa>= 3060 psiDie
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity  <= 0.00050 ohm-cm
@Temperature 150 °C,
Time 3600 sec
<= 0.00050 ohm-cm
@Temperature 302 °F,
Time 1.00 hour
 <= 0.0050 ohm-cm
@Temperature 80.0 °C,
Time 10800 sec
<= 0.0050 ohm-cm
@Temperature 176 °F,
Time 3.00 hour
 <= 0.0090 ohm-cm
@Temperature 23.0 °C,
Time 259000 sec
<= 0.0090 ohm-cm
@Temperature 73.4 °F,
Time 72.0 hour
 
Thermal PropertiesMetricEnglishComments
CTE, linear 53.0 µm/m-°C29.4 µin/in-°FBelow Tg
 107 µm/m-°C59.4 µin/in-°FAbove Tg
Thermal Conductivity 1.38 W/m-K9.58 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 160 °C320 °FContinuous
 260 °C500 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 30.0 °C>= 86.0 °FDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 316 °C601 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time  15.0 min
@Temperature 150 °C
0.250 hour
@Temperature 302 °F
 180 min
@Temperature 80.0 °C
3.00 hour
@Temperature 176 °F
 4320 min
@Temperature 23.0 °C
72.0 hour
@Temperature 73.4 °F
Pot Life 240 min240 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
12.0 Month
@Temperature 77.0 °F
 
Descriptive Properties
ColorAmberPart B
 SilverPart A
ConsistencySmooth thixotropic paste
Ionic Impurities NH440 ppm
Mix Ratio by Weight10:1
Number of ComponentsTwo
Thixotropic Index5.2
Weight Loss0.31%200°C
 0.65%250°C
 1.93%300°C

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PPOXYT020 / 141058

Chemically Resistant adhesives

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